Simulation of ultrasonic inspection involving multiple skips and realistic defects

S. Chatillon, N. Leymarie, G. Rougeron, S. Mahaut

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

For several years, simulation tools aiming at predicting results of ultrasonic inspection have been developed and integrated into the CIVA simulation platform software at CEA-LIST. Those models have recently been extended in order to take account of more complex phenomena, as multiple skips (over backwall, surface, lateral walls of components), mode conversion arising in internal medium of heterogeneous parts, and interaction between branches of ramified flaws. In addition to canonical (planar and cylindrical parts), parametric (nozzles) and 2D CAD components (complex profile and translation or revolution extrusion) already dealt with, those skills are now also available for 3D CAD components. Dedicated tools have also been developed in order to help for interpretation, settings and time saving of the computation: advanced ray tracing for displaying different echo modes (one or several skips, mode conversions, possibility to display only rays coming back to the receiving probes, selection of specific echoes), selection of specific zones over a 3D component to define echogeneous areas... These developments are illustrated through several industrial applications.

Original languageEnglish
Title of host publicationReview of Progress in Quantitative Nondestructive Evaluation
Pages83-90
Number of pages8
DOIs
Publication statusPublished - 10 Nov 2011
Externally publishedYes
Event37th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE - San Diego, CA, United States
Duration: 18 Jul 201023 Jul 2010

Publication series

NameAIP Conference Proceedings
Volume1335
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference37th Annual Review of Progress in Quantitative Nondestructive Evaluation, QNDE
Country/TerritoryUnited States
CitySan Diego, CA
Period18/07/1023/07/10

Keywords

  • 3D CAD
  • CIVA software
  • Simulation
  • Ultrasonic

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